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| MBRD5H100T4G SWITCHMODEt Schottky Power Rectifier Surface Mount Power Package This series of Power Rectifiers employs the Schottky Barrier principle in a large metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. Features http://onsemi.com * * * * * * Guardring for Stress Protection Low Forward Voltage 175C Operating Junction Temperature Epoxy Meets UL 94 V-0 @ 0.125 in Short Heat Sink Tab Manufactured - Not Sheared! This is a Pb-Free Device SCHOTTKY BARRIER RECTIFIER 5 AMPERES, 100 VOLTS 1 4 3 Mechanical Characteristics: (Pin 1: No Connect) * Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 * Weight: 0.4 grams (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * * * Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) 4 12 3 DPAK CASE 369C MARKING DIAGRAM YWW B 5100G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 146C Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz) TC = 146C Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction and Storage Temperature Range (Note 1) Symbol VRRM VRWM VR IF(AV) IFRM Value 100 Unit V Y WW B5100 G = Year = Work Week = Device Code = Pb-Free Package 5 10 A A ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. IFSM 105 A TJ, Tstg - 65 to +175 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA. (c) Semiconductor Components Industries, LLC, 2007 1 September, 2007 - Rev. 1 Publication Order Number: MBRD5H100/D MBRD5H100T4G THERMAL CHARACTERISTICS Characteristic Thermal Resistance, - Junction-to-Case (Note 2) - Junction-to-Ambient (Note 2) 2. When mounted using minimum recommended pad size on FR-4 board. Symbol RqJC RqJA Value 1.6 95.8 Unit C/W ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 3) (IF = 5 A, TJ = 25C) (IF = 5 A, TJ = 125C) Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 125C) (Rated dc Voltage, TJ = 25C) 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0% Symbol VF 0.71 0.60 IR 4.5 3.5 mA mA Value Unit V ORDERING INFORMATION Device MBRD5H100T4G Package DPAK (Pb-Free) Shipping 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MBRD5H100T4G IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 100 100 10 10 1 150C 25C 1 150C 25C 0.1 0.1 125C 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.1 0.1 125C 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 10 Ir, REVERSE CURRENT (mA) 1 0.1 0.01 0.001 150C Ir, REVERSE CURRENT (mA) 100 10 1 0.1 0.01 0.001 0.0001 25C 150C 125C 125C 25C 0.0001 0.00001 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (V) 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current 1200 I F(AV) , AVERAGE FORWARD CURRENT (A) 1000 C, CAPACITANCE (pF) 800 600 400 200 0 0 20 40 60 80 100 VR, REVERSE VOLTAGE (V) 10 9 8 7 6 5 4 3 2 1 0 145 150 155 160 165 170 175 180 Square dc TJ = 25C f = 1 MHz TC, CASE TEMPERATURE (C) Figure 5. Typical Capacitance Figure 6. Current Derating, Case, Per Leg http://onsemi.com 3 MBRD5H100T4G P F(AV) , AVERAGE POWER DISSIPATION (W) I F(AV) , AVERAGE FORWARD CURRENT (A) 5 4 dc 3 Square Wave 2 22 20 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 IF(AV), AVERAGE FORWARD CURRENT (A) dc Square Wave 1 0 0 20 40 60 80 100 120 140 160 180 TA, AMBIENT TEMPERATURE (C) Figure 7. Current Derating, Ambient, Per Leg Figure 8. Forward Power Dissipation 100 50% (DUTY CYCLE) 20% 10% 5.0% 2.0% 1.0% 10 R(t) (C/W) 1.0 0.1 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 0.001 0.01 PULSE TIME (s) 0.1 1.0 10 100 1000 Figure 9. Thermal Response, Junction-to-Case http://onsemi.com 4 MBRD5H100T4G PACKAGE DIMENSIONS DPAK (SINGLE GUAGE) CASE 369C ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 --0.035 0.050 0.155 --MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 --0.89 1.27 3.93 --- -TB V R 4 SEATING PLANE C E A S 1 2 3 Z U K F L D G 2 PL J H 0.13 (0.005) T DIM A B C D E F G H J K L R S U V Z M SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 3.0 0.118 SCALE 3:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 MBRD5H100/D |
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